Topdiode MBR40100DCT is a nice alternative offer for STMicroelectronics STPS20M100SG
- High efficiencty operation
- Low power loss
- Low stored charge majority carrier conduction
- High forward surge capability
- Lead free in compliance with EU RoHS
- 2011/65/EU directive
Topdiode Schottky Barrier Rectifiers MBR40100DCT
Topdiode MBR40100DCT is a high-performance power Schottky rectifier, for high-frequency switch-mode power supplies
Topdiode MBR40100DCT is a nice alternative offer for STMicroelectronics STPS20M100SG
Topdiode 650V 5A Silicon Carbide (SiC) Schottky Diode TPDG5S65C1P DATA
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MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C)
| RATINGS | SYMBOL | MBR 4040CT 4040FCT 4040WCT 4040DCT |
MBR 4045CT 4045FCT 4045WCT 4045DCT |
MBR 4060CT 4060FCT 4060WCT 4060DCT |
MBR 40100CT 40100FCT 40100WCT 40100DCT |
MBR 40150CT 40150FCT 40150WCT 40150DCT |
MBR 40200CT 40200FCT 40200WCT 40200DCT |
UNIT |
| Maximum repetitive reverse voltage | VRRM | 40 | 45 | 60 | 100 | 150 | 200 | V |
| Maximum RMS voltage | VRMS | 28 | 32 | 42 | 70 | 105 | 140 | V |
| Maximum DC blocking voltage | VDC | 40 | 45 | 60 | 100 | 150 | 200 | V |
| Maximum average per device
forward current per diode |
IAV | 4020 | A | |||||
| Peak forward surge current, 8 .3ms single half sine-wave superimposed on rated load |
IFSM | 380 | A | |||||
| TO-220AB Typical thermal resistance ITO-220AB (Note 1) TO-262AB TO-263(D2 PAK) |
Rθ-JC | 2.0 4.5 2.5 2.5 |
°C/W | |||||
| Operating junction temperature range | TJ | -55 to +150 | -55 to +175 | °C/W | ||||
| Storage temperature range | TSTG | -55 to +175 | °C/W | |||||
| CHARACTERISTICS | SYMBOL | MBR 4040CT 4040FCT 4040WCT 4040DCT |
MBR 4045CT 4045FCT 4045WCT 4045DCT |
MBR 4060CT 4060FCT 4060WCT 4060DCT |
MBR 40100CT 40100FCT 40100WCT 40100DCT |
MBR 40150CT 40150FCT 40150WCT 40150DCT |
MBR 40200CT 40200FCT 40200WCT 40200DCT |
UNIT |
| Maximum forward voltage per leg at IF=20A | VF | 0.65 | 0.75 | 0.85 | 0.95 | V | ||
| Maximum average reverse TJ=25°C
current at rated DC blocking voltage TJ=100°C |
IR | 0.1 25 |
0.01 15 |
mA | ||||
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SiC Schottky Barrier Diode Datasheet
Topdiode SiC Schottky Barrier Diode Used on DC charging pile
With an eye to the goal set by China government, that is, to have 6.543 million electric vehicles running on the roads by 2025, and to increase the ratio of charging piles to electric vehicles to 2.25 by 2025, there will be a huge demand for efficient charging modules and cost-effective charging piles. Meet the huge growth of infrastructure. In high-power and high-temperature environments, silicon carbide devices show obvious advantages over current silicon-based devices in terms of efficiency and cost.
Topdiode Recommended Products：
SiC Diode：TPDD20A120C1P，TPD40A120C1P
SiC Mosfet：TPMW30N120C1P
Topdiode Silicon Carbide (SiC) Schottky Diode Applications
Silicon carbide (SiC), a semiconductor compound consisting of silicon (Si) and carbon (C), belongs to the wide bandgap (WBG) family of materials. Its physical bond is very strong, giving the semiconductor a high mechanical, chemical and thermal stability. The wide band gap and high thermal stability allow SiC devices to be used at junction temperatures higher than those of silicon, even over 200°C. The main advantage offered by silicon carbide in power applications is its low drift region resistance, which is a key factor for high-voltage power devices.
Silicon Carbide Schottky Barrier Diodes are semiconductor devices that consist of a metal contact on a layer of n-type Silicon Carbide (SiC) material. The metal contact forms a Schottky barrier with the SiC material, which allows the flow of current in only one direction. SiC Schottky barrier diodes offer several advantages over conventional diodes, including lower forward voltage drop, shorter reverse recovery time, higher breakdown voltage, and higher temperature operation
The working principle of a Silicon Carbide (SiC) Schottky diode is based on the metal-semiconductor junction known as the Schottky barrier. When a metal (typically aluminum or platinum) is deposited on a SiC substrate, a Schottky barrier is formed between the metal and the semiconductor material. Unlike traditional P-N junction diodes, the Schottky diode does not have a depletion region, which leads to a lower forward voltage drop and faster switching speed.
In forward bias, the metal contact is connected to the positive terminal of a voltage source, while the SiC substrate is connected to the negative terminal. When a positive voltage is applied, the electrons from the metal contact are injected into the SiC substrate, resulting in a flow of current through the device. The forward voltage drop in a SiC Schottky diode is typically lower than in a traditional P-N junction diode, which leads to lower power losses and higher efficiency.
In reverse bias, the metal contact is connected to the negative terminal of a voltage source, while the SiC substrate is connected to the positive terminal. When a negative voltage is applied, the Schottky barrier width increases, and the electric field across the device increases, leading to a breakdown of the device at a certain voltage, known as the reverse breakdown voltage. The reverse breakdown voltage of SiC Schottky diodes is typically higher than in traditional P-N junction diodes, which makes them suitable for high-voltage applications.
High-frequency switched-mode power supplies (SMPS)
DC/DC converters
Automotive power supplies and high-power sound amplifier inverters
Telecom and desktop power distribution
Our SiC Schottky Barrier Diodes (SBDs) increase efficiency and add superior reliability in high-voltage applications. SiC diodes exhibit higher breakdown voltage with a lower forward voltage drop and a significantly shorter reverse recover time. SiC SBDs are designed with balanced surge current, forward voltage, thermal resistance and thermal capacitance ratings at low reverse current for lower switching loss, enabling more efficient power systems.