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  • TRIACs F01 Series 1A 800V-Topdiode
  • TRIACs F01 Series 1A 800V-Topdiode
  • TRIACs F01 Series 1A 800V-Topdiode
  • TRIACs F01 Series 1A 800V-Topdiode
  • TRIACs F01 Series 1A 800V-Topdiode
  • TRIACs F01 Series 1A 800V-Topdiode
  • TRIACs F01 Series 1A 800V-Topdiode
  • TRIACs F01 Series 1A 800V-Topdiode

TRIACs F01 Series 1A 800V-Topdiode

Glass Passivated Junctions
High voltage and surge capability
Low Thermal Resistance and Durability
Triggering in all four quadrants

TRIACs F01 Series 1A 800V-Topdiode

Topdiode F0105-8U,plastic single-ended leaded (through hole) package; 3 leads

Topdiode TRIACs F01 Series 1A 800V DATA

ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Value Unit
Storage junction  temperature range Tstg -40 ~ 150
Operating junction temperature range Tj -40~ 125
Repetitive peak off-state voltage (T =25℃) VDRM 600/800 V
Repetitive peak reverse voltage (T =25℃) VRRM 600/800 V
Non repetitive surge peak Off-state voltage VDSM VDRM +100 V
Non repetitive peak reverse voltage VRSM VRRM +100 V
RMS on-state current SOT-89/SOT-223/SOT-223-2L
(TC=70℃)
IT(RMS) 1 A
TO-92 (TC=51℃)
    Non repetitive surge peak on-state current
(180° conduction angle, F=50Hz)
ITSM 12 A
I2t value for fusing (tp= 10ms) I2t 0.72 A2 S
   Critical rate of rise of on-state current
(I =2×IGT, tr ≤ 100 ns)
di/dt 20 A/μS
Peak gate current IGM 1 A
Average gate power dissipation PG(AV) 0.5 W
Thermal Resistances
Symbol Parameter Value Unit
Rth(j-c) Junction to case (AC) TO-92 60 ℃/W
SOT-89 30
SOT-223 30
SOT-223-2L 30
ELECTRICAL CHARACTERISTICS (T=25℃unless otherwise specified)
Symbol Test Condition Quadrant Value Unit
03
IGT VD=12V Ⅰ-Ⅱ-Ⅲ MAX 3 mA
7 V
VGT ALL MAX 1.3
VGD VD=VDRM Tj=125℃ ALL MIN 0.2 V
IL IG= 1.2IGT Ⅰ -Ⅲ MAX 5 mA
Ⅱ -Ⅳ 15
IH IT=200mA MAX 5 mA
dV/dt VD=2/3VDRM Gate Open  Tj=125℃ MIN 20 V/μs
STATIC CHARACTERISTICS
Symbol Parameter Value(MAX.) Unit
VTM ITM=1.4A tp=380μs Tj =25℃ 1.5 V
IDRM VD=VDRM VR=VRRM Tj =25℃ 5 μA
IRRM Tj = 125℃ 5 mA

 

Topdiode Hot Selling Products (6)

Topdiode SiC Schottky Barrier Diode Used on UPS (Server Power Supply)

Because of the proportional relationship between computing power and energy consumption, the data center is undoubtedly a “big energy consumer”. According to the statistics of the U.S. Department of Energy, the power consumption of data centers accounts for 2% of the national electricity consumption.

Technically, energy consumption can be reduced by 40% by upgrading the power supply systems. For example, using APS SiC MOSFET and diode in the high voltage DC power supply system can simplify the power supply structure, improve the efficiency and reduce the number of heat sinks.

The growth of global computer server farms and Internet traffic leads to the accelerated consumption of global energy production by this infrastructure. Now, it is estimated that 500,000 data centers and 32 million personal servers around the world consume 1.5% of the world’s electricity-about 300 TWh per year.

Topdiode Recommended Products:
SiC Diode:TPDA10S65C1P,TPDA15S65C1P,TPDB20A65C1P
SiC Mosfet:TPMW60N65C1P

SiC SBD 22

Topdiode Silicon Carbide (SiC) Schottky Diode Applications

Power Supplies
Solar Inverter
Motor Drives
What is SiC?

Silicon carbide (SiC), a semiconductor compound consisting of silicon (Si) and carbon (C), belongs to the wide bandgap (WBG) family of materials. Its physical bond is very strong, giving the semiconductor a high mechanical, chemical and thermal stability. The wide band gap and high thermal stability allow SiC devices to be used at junction temperatures higher than those of silicon, even over 200°C. The main advantage offered by silicon carbide in power applications is its low drift region resistance, which is a key factor for high-voltage power devices.

What is Silicon Carbide (SiC) Schottky Barrier Diodes?

Silicon Carbide Schottky Barrier Diodes are semiconductor devices that consist of a metal contact on a layer of n-type Silicon Carbide (SiC) material. The metal contact forms a Schottky barrier with the SiC material, which allows the flow of current in only one direction. SiC Schottky barrier diodes offer several advantages over conventional diodes, including lower forward voltage drop, shorter reverse recovery time, higher breakdown voltage, and higher temperature operation

What is the Working Principle of SiC Schottky Barrier Diodes?

The working principle of a Silicon Carbide (SiC) Schottky diode is based on the metal-semiconductor junction known as the Schottky barrier. When a metal (typically aluminum or platinum) is deposited on a SiC substrate, a Schottky barrier is formed between the metal and the semiconductor material. Unlike traditional P-N junction diodes, the Schottky diode does not have a depletion region, which leads to a lower forward voltage drop and faster switching speed.

In forward bias, the metal contact is connected to the positive terminal of a voltage source, while the SiC substrate is connected to the negative terminal. When a positive voltage is applied, the electrons from the metal contact are injected into the SiC substrate, resulting in a flow of current through the device. The forward voltage drop in a SiC Schottky diode is typically lower than in a traditional P-N junction diode, which leads to lower power losses and higher efficiency.

In reverse bias, the metal contact is connected to the negative terminal of a voltage source, while the SiC substrate is connected to the positive terminal. When a negative voltage is applied, the Schottky barrier width increases, and the electric field across the device increases, leading to a breakdown of the device at a certain voltage, known as the reverse breakdown voltage. The reverse breakdown voltage of SiC Schottky diodes is typically higher than in traditional P-N junction diodes, which makes them suitable for high-voltage applications.

TRIACs F01 Series 1A 800V Application-Topdiode

Heating regulation
In-duction motor starting circuits
Phase control operation in light dimmers
Motor speed controllers

What are Benefits of Topdiode SiC Schottky Barrier Diodes?

Our SiC Schottky Barrier Diodes (SBDs) increase efficiency and add superior reliability in high-voltage applications. SiC diodes exhibit higher breakdown voltage with a lower forward voltage drop and a significantly shorter reverse recover time. SiC SBDs are designed with balanced surge current, forward voltage, thermal resistance and thermal capacitance ratings at low reverse current for lower switching loss, enabling more efficient power systems.

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